Thermal Interface Materials TIC800A The thermal Interface MaterialsTIC™800A Series islow melting point thermal interface material. At 50°C, The TIC™800A Series begins to
Thermally Conductive Tape Thethermally Conductive Tape of TIA™605 Series is a thermally conductive pressure sensitive adhesive tape. It is designed to withstand the high
Thermall conductive tape-LED Daylight The thermall conductive tape of TIA™800FG Series products for LED Daylightusing ,they are mostly used for bonding heat dissipation fins, microp
CPU-Thermally Conductive Gap The thermal conductive of TIF™300 Series are applied to fill the air gaps between the heating elements and the heat dissipation fins or the met
thermal grease for LED and CPU The thermal grease of TIG™ 780 Series products are the high-efficiency heat dissipation ones for the fillings between the electronic components
Thermally Conductive Insulators The thermally Conductive Insulators of TIS™100 Series products are the high-efficiency insulation ones with thermal conduction properties. The
Thermal Gap The thermal Gap ofTIF™500S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and th
Thermally Conductive Gap Fillers The thermally Conductive Gap Fillers ofTIF™400 Series thermally conductive interface materials are applied to fill the air gaps between the hea
High Performance Electric & Thermal Conductive The High Performance Electric & Thermal Conductive Interface Materialsof TIR™600-10 Series products are high-performance and heat-conductiv
Thermally Conductive Insulators The thermally Conductive Insulators of TIS™800 Series products are the high-efficiency insulation ones with thermal conduction properties. The
Thermally Conductive Pressure Sensitive Adhesive T The TIA 806FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This typ
Low Melting Point Thermal Adhesives The Low Melting Point Thermal of TIC™800P Series islow melting point thermal interface material. At 50°C, The TIC™800P Series begins
Thermal Pad The thermal PAD oTIF™100 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the
Thermal grease Thermal grease of TIG™780-18 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the
LED Thermal PAD LED Thermal PAD of P100 series materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal bas
